Copper foil and copper-clad laminate comprising same

The purpose of the present invention is to provide a copper foil with which excellent adhesion, transmission characteristics, and heat resistance can be achieved and to provide a copper-clad laminate using the same. This copper foil is characterized in that when the characteristics of the adhesive s...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SATO, AKIRA, UNO, TAKEO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TRANSPORTING
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Beschreibung
Zusammenfassung:	The purpose of the present invention is to provide a copper foil with which excellent adhesion, transmission characteristics, and heat resistance can be achieved and to provide a copper-clad laminate using the same. This copper foil is characterized in that when the characteristics of the adhesive surface of the copper foil are expressed using the number Wn of waves and roughness motif mean depth R which are calculated from a roughness motif determined by a motif method defined by JIS B0631:2000, the number Wn of waves is 11-30 per mm and the roughness motif mean depth R is 0.20-1.10 [mu]m.