Adhesive composition and application thereof

The present invention relates to an adhesive composition and an application thereof. The adhesive composition is consisting of an aliphatic diamine compound, an isocyanate compound having a structure of formula (I) and a solvent: in the formula (I), R represents a saturated or unsaturated group of 2...

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Bibliographische Detailangaben
Hauptverfasser:	LIN, PO-WEN, LIN, SHENGIN, HSU, WUOU, CHANG, HSIU-MING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention relates to an adhesive composition and an application thereof. The adhesive composition is consisting of an aliphatic diamine compound, an isocyanate compound having a structure of formula (I) and a solvent: in the formula (I), R represents a saturated or unsaturated group of 2 to 6 carbons. The adhesive composition has excellent heat-resistance propery, and the adhesive composition also has excellent adhesive property at high temperature.