Connection structure, circuit connection member, and adhesive composition

The present invention provides a connection structure provided with: a first circuit member having a first circuit electrode; a second circuit member having a second circuit electrode; and a circuit connection member which is disposed between the first circuit member and the second circuit member an...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	TANAKA, MASARU, TAKETATSU, JUN, MORIJIRI, TOMOKI, KUME, MASAHIDE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CURRENT COLLECTORS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention provides a connection structure provided with: a first circuit member having a first circuit electrode; a second circuit member having a second circuit electrode; and a circuit connection member which is disposed between the first circuit member and the second circuit member and which electrically connects the first circuit electrode and the second circuit electrode to each other, wherein the linear thermal expansion amount L(t) of the circuit connection member at temperature (t) satisfies the condition dL(t)/dt < 0 at least at a point within t = 30 DEG C to 12 DEG C.