Electronic package and method of manufacture

Provided is an electronic package, comprising a carrier structure, an electronic element and a shielding member disposed on the carrier structure, an encapsulating layer formed on the carrier structure for encapsulating the electronic element and the shielding member, a metallic layer formed on the encapsulating layer and electrically connected to the shielding member, and an alignment member disposed at a side of the encapsulating layer, thereby allowing the periphery of the electronic element to be covered by the shielding member and the metallic layer to avoid external electromagnetic interference. The invention further provides a method for manufacturing the electronic package as described above.