Wafer processing method and polishing device including a wafer holding step, a strained layer removing step, a polishing liquid removing step, and a gettering layer formation step

This invention provides a wafer processing method and a polishing device that can be quickly transferred to a gettering layer after polishing, and processed into a designed wafer. The solution is a wafer processing method that forms a gettering layer on a back surface of a wafer by using a polishing pad. The method includes: a wafer holding step of attaching a BG adhesive tape affixed to the front surface of a wafer to a work clamp; a strained layer removing step of removing the strained layer from the back surface of the wafer while rotating the polishing pad and the work clamp as the polishing liquid is supplied to the polishing pad; a polishing liquid removing step of supplying the cleaning liquid from the nozzle toward the polishing pad to remove the remaining polishing liquid after the strained layer removing step is performed; and a gettering layer formation step of forming a gettering layer on the back surface of the wafer while rotating the polishing pad and the work clamp as the liquid containing no