Micromechanical component
Method for producing a micromechanical component (100), comprising the steps of: - providing a MEMS wafer (10); - providing an ASIC wafer (20); - forming in the MEMS wafer (10) at least two fixed or movable structures (14, 15) that are at least in certain portions arranged one on top of the other; -...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | Method for producing a micromechanical component (100), comprising the steps of: - providing a MEMS wafer (10); - providing an ASIC wafer (20); - forming in the MEMS wafer (10) at least two fixed or movable structures (14, 15) that are at least in certain portions arranged one on top of the other; - connecting the MEMS wafer (10) to the ASIC wafer (20); - forming electrically conducting connecting elements in the MEMS wafer (10), the connecting elements penetrating through the at least two fixed or movable structures (14, 15) in the MEMS wafer (10) and being formed up to the ASIC wafer (20); and - applying a cap wafer (30) to the wafers (10, 20) that are connected to one another. |
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