Method for fabricating fingerprint identifying module and method for cutting fingerprint identifying sensing element

The present invention discloses method for fabricating fingerprint identifying module. The method retains a strip film during a sensing strip cutting process, such that the size of the fingerprint identifying sensing element's upper surface closes to a predetermined size. Then, cutting the stri...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HSU, MAO-HSIU, CHUANG, YINGIEH, CHEN, HSIN-TSO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING RECORD CARRIERS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRESENTATION OF DATA PRINTED CIRCUITS RECOGNITION OF DATA RECORD CARRIERS
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Beschreibung
Zusammenfassung:	The present invention discloses method for fabricating fingerprint identifying module. The method retains a strip film during a sensing strip cutting process, such that the size of the fingerprint identifying sensing element's upper surface closes to a predetermined size. Then, cutting the strip film and a concave is formed on the fingerprint identifying sensing element's bottom surface. It makes the size of the fingerprint identifying sensing element's bottom surface is smaller than the size of the fingerprint identifying sensing element's upper surface. The fingerprint identifying sensing element can pass the size testing process even the fingerprint identifying sensing element is cut askew.