Optical component package structure

The present application provides an optical component package structure, including: a substrate having a first surface and a second surface opposite to each other; a barrier structure formed on the first surface of the substrate and surrounding a accommodation space; an optical component chip disposed on the first surface of the substrate and located inside the accommodation space; a bonding layer formed on a portion of an upper edge of the barrier structure; a transparent plate mounted on the bonding layer and completely covering the bonding layer and the accommodation space wherein an lateral edge of the transparent plate is beyond an outer edge of the bonding layer, the transparent plate has a first surface and a second surface opposite to each other, and the second surface faces toward the accommodation space; and an encapsulation body completely covering the lateral edge of the transparent plate and the outer edge of the bonding layer, and partially covering the second surface of the transparent plate an