Molding system for applying a uniform clamping pressure onto a substrate

A molding system for encapsulating electronic devices mounted on a substrate, the molding system comprising a first mold chase with a first mold chase surface and a second mold chase with a second mold chase surface opposite to the first mold chase10 surface, the first and second mold chase surfaces...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HAO, JI-YUAN, WU, KAI, ONG, CHIN GUAN, HO, SHU CHUEN, KUAH, TENG HOCK, CHEONG, CHOON HONG
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:A molding system for encapsulating electronic devices mounted on a substrate, the molding system comprising a first mold chase with a first mold chase surface and a second mold chase with a second mold chase surface opposite to the first mold chase10 surface, the first and second mold chase surfaces being operative to clamp onto the substrate and to apply a clamping pressure thereto. The molding system further comprises a first sensor located at a first position for determining a first relative distance between the substrate and a mold chase facing the substrate at the first position, and a second sensor located at a second position for determining a second relative distance15 between the substrate and a mold chase facing the substrate at the second position. The molding system also comprises a first actuator located adjacent to the first position and a second actuator located adjacent to the second position, wherein the first and second actuators are operative to adjust the first relative distance with respe