Waterproof package module and waterproof package process capable of preventing moisture from entering the chip area through a gap between the encapsulant layer and the carrier so as to improve the reliability of the chip

A waterproof package module and a waterproof package process are disclosed. The waterproof package module comprises a carrier, at least one chip disposed on the carrier, an encapsulant layer formed on the carrier and covering the chip, and a waterproof layer formed on the surface of the encapsulant layer and covering the interface between the encapsulant layer and the substrate. The waterproof package module prevents moisture from entering the chip area through the gap between the encapsulant layer and the carrier so as to improve the reliability of the chip. The waterproof package process comprises the following steps: a preparation step of preparing a carrier and at least one chip, disposing the chip on the carrier and electrically connecting to a lead frame; a packaging step of preparing an encapsulant layer on the carrier so that the encapsulant layer covers the chip and the lead frame; and a waterproofing step of forming a waterproof layer on the surface of the encapsulant layer so that the waterproof la