Manufacturing method of circuit board

A manufacturing method of circuit board is provided. The method includes disposing an electronic component with a plurality of pads into a groove formed by a substrate and an adhesive layer. Forming a dielectric layer which covers the pads, the electronic component, the adhesive layer and the substrate, and etching the dielectric layer to expose the upper surfaces of the pads. Next, forming a composite material layer sequentially including a plating dielectric layer, a conductive polymer layer and an anti-plating layer to cover the pads and the dielectric layer. Afterwards, forming a plurality of openings in the composite material layer to expose a portion of the pads and the dielectric layer. Forming a metal layer, which is connected to the conductive polymer layer, on the bottom and part of the side walls composed of the plating dielectric layer and the conductive polymer layer of the openings. Forming a circuit layer in the openings, and removing the conductive polymer layer and the anti-plating layer, whe