Electronic stack-up structure and the manufacture thereof

Electronic stack-up structure and the manufacture thereof

Provided is an electronic stack-up structure, comprising a first substrate, a passive element and a first electronic element disposed on the first substrate, and a second substrate disposed on the passive element, thereby stacking the second substrate up to the first substrate via the passive elemen...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHIU, CHIH-HSIEN, SHIH, CHI-LIANG, CHANG, YUEHIUNG, CHEN, CHIA-YANG, HUNG, JIA-HUEI
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Provided is an electronic stack-up structure, comprising a first substrate, a passive element and a first electronic element disposed on the first substrate, and a second substrate disposed on the passive element, thereby stacking the second substrate up to the first substrate via the passive element and using the height and size of the passive element to secure the distance between the first and second substrates. The invention further provides a method for manufacturing the electronic stack-up structure as described above.