Work carrier and work carrier manufacturing method

Provided is a work carrier having high integrity between a carrier substrate and a resin insert portion. A work carrier 10 in which a resin insert portion 3 is provided along the inner peripheral surface of a work holding hole 2 formed in a metallic carrier substrate 1. Then, the workpiece holding h...

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Bibliographische Detailangaben
1. Verfasser:	MITSUHASHI, SHINICHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided is a work carrier having high integrity between a carrier substrate and a resin insert portion. A work carrier 10 in which a resin insert portion 3 is provided along the inner peripheral surface of a work holding hole 2 formed in a metallic carrier substrate 1. Then, the workpiece holding holes 2, alternately in the circumferential direction, the positive inclined surface inclined is opposite with respect to the front and back direction (the positive slope portion 21) and the negative slope surface (negative slope portion 22) is formed continuously, and the resin insert section 3 is formed in close contact with the positive slope surface and the negative slope side.