Adhesive tape for semiconductor wafer processing and method for processing semiconductor wafer

An adhesive tape for semiconductor wafer processing, which comprises an adhesive layer on at least one surface of a base film, and which is characterized in that the adhesive in the adhesive layer is a radiation curable adhesive and comprises at least a resin or oligomer selected from among a base r...

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1. Verfasser: OKURA, MASATO
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:An adhesive tape for semiconductor wafer processing, which comprises an adhesive layer on at least one surface of a base film, and which is characterized in that the adhesive in the adhesive layer is a radiation curable adhesive and comprises at least a resin or oligomer selected from among a base resin having an ethylenically unsaturated group (that is a radiation polymerizable carbon-carbon double bond and an ethylenic double bond) in a side chain, an acrylic pressure sensitive base resin containing no monomer unit derived from an alicyclic (meth)acrylate, and a urethane acrylate oligomer having at least two ethylenically unsaturated groups (that are radiation polymerizable carbon-carbon double bonds and ethylenic double bonds) in each molecule, and that the adhesive contains 0.2-2.0 mmol/g of an ethylenically unsaturated group; a method for producing an adhesive tape for semiconductor wafer processing; and a method for processing a semiconductor wafer.