Method for bonding flexible substrate

To provide a method for bonding a flexible substrate, said method making it possible to bond the flexible substrate using a reflow furnace. A substrate 1 is mounted on a transfer jig 2A, a solder paste is applied to an electrode of the substrate 1 mounted on the transfer jig 2A, a flexible substrate...

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Bibliographische Detailangaben
Hauptverfasser:	TAKAGI, YOSHINORI, ICHIKAWA, RYO, SAKUMA, HARUYA, MINAKUCHI, DAISUKE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	To provide a method for bonding a flexible substrate, said method making it possible to bond the flexible substrate using a reflow furnace. A substrate 1 is mounted on a transfer jig 2A, a solder paste is applied to an electrode of the substrate 1 mounted on the transfer jig 2A, a flexible substrate 4 is mounted on a correction plate 5, the flexible substrate 4 mounted on the correction plate 5 is placed on the substrate 1 mounted on the transfer jig 2A, the solder paste is melted by being heated in a reflow furnace, and the electrode of the substrate 1 and an electrode of the flexible substrate 4 are bonded to each other by means of the solder.