Deformable conductive contacts

Deformable conductive contacts are provided. A plurality of deformable contacts on a first substrate may be joined to a plurality of conductive pads on a second substrate during die level or wafer level assembly of microelectronics. Each deformable contact complies to a degree that is related to the...

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Bibliographische Detailangaben
Hauptverfasser: HABA, BELGACEM, DISTEFANO, THOMAS
Format: Patent
Sprache:chi ; eng
Schlagworte:
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