Projection exposure apparatus and method for measuring a projection lens

Microlithographic projection exposure apparatus (100), having a projection lens (150) for imaging an object plane (155) onto an image plane (156), wherein an immersion liquid is at least temporarily provided during operation of the projection exposure apparatus (100) between the projection lens (150...

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Hauptverfasser: SCHADT, FRANK, FOCA, EUGEN, HEMPELMANN, UWE, SCHLEICHER, FRANK
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Sprache:chi ; eng
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creator SCHADT, FRANK
FOCA, EUGEN
HEMPELMANN, UWE
SCHLEICHER, FRANK
description Microlithographic projection exposure apparatus (100), having a projection lens (150) for imaging an object plane (155) onto an image plane (156), wherein an immersion liquid is at least temporarily provided during operation of the projection exposure apparatus (100) between the projection lens (150) and the image plane (156), wherein a measurement structure (121) is arranged in the immersion liquid, wherein the measurement structure (121) is configured to generate a measurement pattern, having a measurement device (130, 160) for measuring the measurement pattern, and wherein the measurement structure (121) has an absorption layer (125) (125) comprising silicon oxide and/or silicon oxynitride and/or nitride.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW201800866A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW201800866A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW201800866A3</originalsourceid><addsrcrecordid>eNrjZPAIKMrPSk0uyczPU0itKMgvLi1KVUgsKEgsSiwpLVZIzEtRyE0tychPUUjLLwIyE4EKMvPSFRIVChAac1LzinkYWNMSc4pTeaE0N4Oim2uIs4duakF-fGpxQWJyal5qSXxIuJGBoYWBgYWZmaMxMWoA89o1AA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Projection exposure apparatus and method for measuring a projection lens</title><source>esp@cenet</source><creator>SCHADT, FRANK ; FOCA, EUGEN ; HEMPELMANN, UWE ; SCHLEICHER, FRANK</creator><creatorcontrib>SCHADT, FRANK ; FOCA, EUGEN ; HEMPELMANN, UWE ; SCHLEICHER, FRANK</creatorcontrib><description>Microlithographic projection exposure apparatus (100), having a projection lens (150) for imaging an object plane (155) onto an image plane (156), wherein an immersion liquid is at least temporarily provided during operation of the projection exposure apparatus (100) between the projection lens (150) and the image plane (156), wherein a measurement structure (121) is arranged in the immersion liquid, wherein the measurement structure (121) is configured to generate a measurement pattern, having a measurement device (130, 160) for measuring the measurement pattern, and wherein the measurement structure (121) has an absorption layer (125) (125) comprising silicon oxide and/or silicon oxynitride and/or nitride.</description><language>chi ; eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; MEASURING ; MEASURING ANGLES ; MEASURING AREAS ; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS ; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; TESTING ; TESTING STATIC OR DYNAMIC BALANCE OF MACHINES ORSTRUCTURES ; TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180101&amp;DB=EPODOC&amp;CC=TW&amp;NR=201800866A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180101&amp;DB=EPODOC&amp;CC=TW&amp;NR=201800866A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SCHADT, FRANK</creatorcontrib><creatorcontrib>FOCA, EUGEN</creatorcontrib><creatorcontrib>HEMPELMANN, UWE</creatorcontrib><creatorcontrib>SCHLEICHER, FRANK</creatorcontrib><title>Projection exposure apparatus and method for measuring a projection lens</title><description>Microlithographic projection exposure apparatus (100), having a projection lens (150) for imaging an object plane (155) onto an image plane (156), wherein an immersion liquid is at least temporarily provided during operation of the projection exposure apparatus (100) between the projection lens (150) and the image plane (156), wherein a measurement structure (121) is arranged in the immersion liquid, wherein the measurement structure (121) is configured to generate a measurement pattern, having a measurement device (130, 160) for measuring the measurement pattern, and wherein the measurement structure (121) has an absorption layer (125) (125) comprising silicon oxide and/or silicon oxynitride and/or nitride.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>MEASURING</subject><subject>MEASURING ANGLES</subject><subject>MEASURING AREAS</subject><subject>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</subject><subject>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>TESTING</subject><subject>TESTING STATIC OR DYNAMIC BALANCE OF MACHINES ORSTRUCTURES</subject><subject>TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPAIKMrPSk0uyczPU0itKMgvLi1KVUgsKEgsSiwpLVZIzEtRyE0tychPUUjLLwIyE4EKMvPSFRIVChAac1LzinkYWNMSc4pTeaE0N4Oim2uIs4duakF-fGpxQWJyal5qSXxIuJGBoYWBgYWZmaMxMWoA89o1AA</recordid><startdate>20180101</startdate><enddate>20180101</enddate><creator>SCHADT, FRANK</creator><creator>FOCA, EUGEN</creator><creator>HEMPELMANN, UWE</creator><creator>SCHLEICHER, FRANK</creator><scope>EVB</scope></search><sort><creationdate>20180101</creationdate><title>Projection exposure apparatus and method for measuring a projection lens</title><author>SCHADT, FRANK ; FOCA, EUGEN ; HEMPELMANN, UWE ; SCHLEICHER, FRANK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW201800866A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>MEASURING</topic><topic>MEASURING ANGLES</topic><topic>MEASURING AREAS</topic><topic>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</topic><topic>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>TESTING</topic><topic>TESTING STATIC OR DYNAMIC BALANCE OF MACHINES ORSTRUCTURES</topic><topic>TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR</topic><toplevel>online_resources</toplevel><creatorcontrib>SCHADT, FRANK</creatorcontrib><creatorcontrib>FOCA, EUGEN</creatorcontrib><creatorcontrib>HEMPELMANN, UWE</creatorcontrib><creatorcontrib>SCHLEICHER, FRANK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SCHADT, FRANK</au><au>FOCA, EUGEN</au><au>HEMPELMANN, UWE</au><au>SCHLEICHER, FRANK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Projection exposure apparatus and method for measuring a projection lens</title><date>2018-01-01</date><risdate>2018</risdate><abstract>Microlithographic projection exposure apparatus (100), having a projection lens (150) for imaging an object plane (155) onto an image plane (156), wherein an immersion liquid is at least temporarily provided during operation of the projection exposure apparatus (100) between the projection lens (150) and the image plane (156), wherein a measurement structure (121) is arranged in the immersion liquid, wherein the measurement structure (121) is configured to generate a measurement pattern, having a measurement device (130, 160) for measuring the measurement pattern, and wherein the measurement structure (121) has an absorption layer (125) (125) comprising silicon oxide and/or silicon oxynitride and/or nitride.</abstract><oa>free_for_read</oa></addata></record>
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language chi ; eng
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subjects APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
TESTING
TESTING STATIC OR DYNAMIC BALANCE OF MACHINES ORSTRUCTURES
TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR
title Projection exposure apparatus and method for measuring a projection lens
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-14T13%3A54%3A45IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SCHADT,%20FRANK&rft.date=2018-01-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW201800866A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true