Shielding film for printed wiring board and printed wiring board
Provided are a shield film for a printed wiring board, and a printed wiring board. In the shield film, a metal layer is not easily broken due to repeated bending and sliding, ranging from a large bending radius to a small bending radius (1.0mm). A shield film (10) for a printed wiring board is provi...
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| creator | KAMINO, KENJI TOTOUGE, MASAYUKI MORIMOTO, SYOHEI KAWAKAMI, YOSHINORI |
| description | Provided are a shield film for a printed wiring board, and a printed wiring board. In the shield film, a metal layer is not easily broken due to repeated bending and sliding, ranging from a large bending radius to a small bending radius (1.0mm). A shield film (10) for a printed wiring board is provided with a metal layer (2) formed on one surface of an insulating layer (1). The arithmetic average roughness (JIS B 0601 (year of 1994)) of the one surface of the insulating layer (1) is 0.5-5.0[mu]m, and a metal layer (2) is formed in a corrugated structure along the one surface of the insulating layer (1). The printed wiring board is provided by attaching the shield film (10) to a base film. |
| format | Patent |
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In the shield film, a metal layer is not easily broken due to repeated bending and sliding, ranging from a large bending radius to a small bending radius (1.0mm). A shield film (10) for a printed wiring board is provided with a metal layer (2) formed on one surface of an insulating layer (1). The arithmetic average roughness (JIS B 0601 (year of 1994)) of the one surface of the insulating layer (1) is 0.5-5.0[mu]m, and a metal layer (2) is formed in a corrugated structure along the one surface of the insulating layer (1). 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In the shield film, a metal layer is not easily broken due to repeated bending and sliding, ranging from a large bending radius to a small bending radius (1.0mm). A shield film (10) for a printed wiring board is provided with a metal layer (2) formed on one surface of an insulating layer (1). The arithmetic average roughness (JIS B 0601 (year of 1994)) of the one surface of the insulating layer (1) is 0.5-5.0[mu]m, and a metal layer (2) is formed in a corrugated structure along the one surface of the insulating layer (1). 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In the shield film, a metal layer is not easily broken due to repeated bending and sliding, ranging from a large bending radius to a small bending radius (1.0mm). A shield film (10) for a printed wiring board is provided with a metal layer (2) formed on one surface of an insulating layer (1). The arithmetic average roughness (JIS B 0601 (year of 1994)) of the one surface of the insulating layer (1) is 0.5-5.0[mu]m, and a metal layer (2) is formed in a corrugated structure along the one surface of the insulating layer (1). The printed wiring board is provided by attaching the shield film (10) to a base film.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING |
| title | Shielding film for printed wiring board and printed wiring board |
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