Shielding film for printed wiring board and printed wiring board

Provided are a shield film for a printed wiring board, and a printed wiring board. In the shield film, a metal layer is not easily broken due to repeated bending and sliding, ranging from a large bending radius to a small bending radius (1.0mm). A shield film (10) for a printed wiring board is provi...

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Bibliographische Detailangaben
Hauptverfasser:	KAMINO, KENJI, TOTOUGE, MASAYUKI, MORIMOTO, SYOHEI, KAWAKAMI, YOSHINORI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided are a shield film for a printed wiring board, and a printed wiring board. In the shield film, a metal layer is not easily broken due to repeated bending and sliding, ranging from a large bending radius to a small bending radius (1.0mm). A shield film (10) for a printed wiring board is provided with a metal layer (2) formed on one surface of an insulating layer (1). The arithmetic average roughness (JIS B 0601 (year of 1994)) of the one surface of the insulating layer (1) is 0.5-5.0[mu]m, and a metal layer (2) is formed in a corrugated structure along the one surface of the insulating layer (1). The printed wiring board is provided by attaching the shield film (10) to a base film.