Polishing apparatus

The present invention relates to a polishing apparatus wherein a polishing body is supported by a head with an interposed elastic instrument to avoid an overshoot on a target load during polishing which occurs when a location control is turned into a load control. According to the present invention,...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OMAGARI, HIROAKI, MUROFUSHI, YU, TOMIYASU, MASATERU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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