Polishing apparatus

The present invention relates to a polishing apparatus wherein a polishing body is supported by a head with an interposed elastic instrument to avoid an overshoot on a target load during polishing which occurs when a location control is turned into a load control. According to the present invention, the polishing apparatus (100) comprises: a possession/support unit (60) which possesses and supports a material to be polished (W); a polishing body (10) which polishes the material to be polished (W); a head (30) which supports the polishing body (10) with an interposed elastic instrument (32); a driving instrument (24) which moves the head (30) in a Z coordinate direction; a control unit (50) which controls the driving instrument (24); and a position sensor (34) which measures a position of the polishing body (10) to the head (30). The load control is conducted based on a measured value of the position sensor (34) and a spring constant of the elastic instrument (32).