Polishing composition containing silicon dioxide particles, glycol ether compound, and water

The present invention provides a polishing composition which can polish sapphire wafers with excellent polishing speed. The polishing composition contains silicon dioxide (SiO2) particles, glycol ether compound, and water. The content of the glycol ether compound contained in the polishing compositi...

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Bibliographische Detailangaben
Hauptverfasser:	EZAWA, SHUNJI, MORIYAMA, KAZUKI, DAITO, TAKESHI, CHINEN, MIKA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES
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