Electro-optical sensor chip assembly, method for forming the same, and method for assembling an electro-optical detector

An electro-optical sensor chip assembly (SCA) is provided and includes a read-out integrated circuit (ROIC), a detector including a substrate, a buffer layer, a pixel layer and an array of pixels disposed in the pixel layer and an interconnect layer interposed between the ROIC and the pixel layer and comprising cold welded interconnect posts respectively extendible to the ROIC from the pixels. The detector is penetrable by visible wavelength light propagating from a direct view window formed in the substrate and the buffer layer to one or more of the pixels.