Swaging process for complex integrated heat spreaders

Swaging process for complex integrated heat spreaders

Embodiments are generally directed to a swaging process for complex integrated heat spreaders. An embodiment of an integrated heat spreader includes components, each of the components including one or more swage points; and a multiple swage joints, each swage joint including a swage pin joining two...

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Bibliographische Detailangaben
Hauptverfasser: GARNER, LUKE J, BEATTY, JOHN J, LABANOK, WILLIAM NICHOLAS, OGATA, KAZUO, HU, WEI, YOUNG, DOUGLAS R, BHATTI, PARDEEP K, KOURAKATA, SHINOBU, TANG, ZHI-ZHONG, JAIN, SYADWAD, START, PAUL R, LI, PENG, CONSTABLE, GREGORY S, ANTONISWAMY, ARAVINDHA R
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Embodiments are generally directed to a swaging process for complex integrated heat spreaders. An embodiment of an integrated heat spreader includes components, each of the components including one or more swage points; and a multiple swage joints, each swage joint including a swage pin joining two or more components, wherein components are joined into a single integrated heat spreader unit by the swage joints.