Substrate processing method and substrate processing device

Provided is a substrate processing method for removing a resist from a substrate on the surface of which the resist having a cured layer is formed, the method including: a substrate holding step in which the substrate is held; and a resist delamination step in which ozone gas and superheated steam a...

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Bibliographische Detailangaben
1. Verfasser:	SOTOKU, KOTA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTROGRAPHY GENERAL PROCESSES OF COMPOUNDING HOLOGRAPHY MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	Provided is a substrate processing method for removing a resist from a substrate on the surface of which the resist having a cured layer is formed, the method including: a substrate holding step in which the substrate is held; and a resist delamination step in which ozone gas and superheated steam are supplied to a plurality of fluid nozzles for mixing a plurality of fluids to generate liquid droplets, and a mixed gas of the ozone gas and the superheated steam is discharged from the plurality of fluid nozzles to the surface of the substrate to delaminate the resist from the surface of the substrate, the mixed gas containing ozone water droplets generated by mixing the ozone gas and the superheated steam.