Resin composition for cleaning die

The invention provides a resin composition for cleaning a die, the resin composition including; a melamine-based resin; a first curing catalyst having a melting temperature of from 43 DEG C to 115 DEG C; and a second curing catalyst having a melting temperature that is from 53 DEG C to 125 DEG C and...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HIROMITSU, KIYOHITO, YOSHIMURA, KATSUNORI, FUKUNISHI, YOUICHI, NOMURA, HIROAKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The invention provides a resin composition for cleaning a die, the resin composition including; a melamine-based resin; a first curing catalyst having a melting temperature of from 43 DEG C to 115 DEG C; and a second curing catalyst having a melting temperature that is from 53 DEG C to 125 DEG C and that is higher by 10 DEG C or more, than the melting temperature of the first curing catalyst.