Electronic package that includes lamination layer

An electronic package that includes a substrate and an electronic component attached to the substrate. A laminated layer is attached to an upper surface of the substrate such that the laminated layer covers the electronic component. The electronic package may further include a stiffener mounted on t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HARRIES, RICHARD J, YAGNAMURTHY, NAGA SIVAKUMAR, SENEVIRATNE, DILAN, YAZZIE, KYLE, MALATKAR, PRAMOD, AKKINEPALLY, PRANEETH, LI, YONG-GANG, SANKMAN, ROBERT L, WAN, XUE-FEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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