Electronic package that includes lamination layer

Electronic package that includes lamination layer

An electronic package that includes a substrate and an electronic component attached to the substrate. A laminated layer is attached to an upper surface of the substrate such that the laminated layer covers the electronic component. The electronic package may further include a stiffener mounted on t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HARRIES, RICHARD J, YAGNAMURTHY, NAGA SIVAKUMAR, SENEVIRATNE, DILAN, YAZZIE, KYLE, MALATKAR, PRAMOD, AKKINEPALLY, PRANEETH, LI, YONG-GANG, SANKMAN, ROBERT L, WAN, XUE-FEI
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic package that includes a substrate and an electronic component attached to the substrate. A laminated layer is attached to an upper surface of the substrate such that the laminated layer covers the electronic component. The electronic package may further include a stiffener mounted on the laminated layer where the stiffener is over the electronic component.