Transmissive composite film for application to the backside of a microelectronic device
A transmissive composite film is described that may be applied to the backside of a microelectronic device, for example an integrated circuit die or a bridge. A microelectronic die package in one example has a substrate, an integrated circuit die attached and electrically connected to the substrate,...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | A transmissive composite film is described that may be applied to the backside of a microelectronic device, for example an integrated circuit die or a bridge. A microelectronic die package in one example has a substrate, an integrated circuit die attached and electrically connected to the substrate, the die having a front side with electrical attachments and a backside, and a composite film attached to a backside of the die, the composite film having a polymer base with nano-fillers to protect the backside of the die. |
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