Assembly layer for flexible display

The present invention is an assembly layer for a flexible device. Within a temperature range of between about -30 DEG C to about 90 DEG C, the assembly layer has a shear storage modulus at a frequency of 1 Hz that does not exceed about 2 MPa, a shear creep compliance (J) of at least about 6*10-6 1/P...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	BEHLING, ROSS ERIC, HAYS, DAVID SCOTT, EVERAERTS, ALBERT IVO, CLAPPER, JASON DOUGLAS, LESUFFLEUR, MARIE ALOSHYNA EP, ERDOGAN-HAUG, BELMA, WON, JONG-SEOB, APPEANING, MARIA AFUA, KINNING, DAVID JOHN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention is an assembly layer for a flexible device. Within a temperature range of between about -30 DEG C to about 90 DEG C, the assembly layer has a shear storage modulus at a frequency of 1 Hz that does not exceed about 2 MPa, a shear creep compliance (J) of at least about 6*10-6 1/Pa measured at 5 seconds with an applied shear stress between about 50 kPa and about 500 kPa, and a strain recovery of at least about 50% at least one point of applied shear stress within the range of about 5 kPa to about 500 kPa within about 1 minute after removing the applied shear stress.