Ultrathin barrier laminates and devices

Ultrathin barrier laminates and devices

Barrier assemblies including ultrathin barrier laminates and methods of making the barrier assemblies are provided. A barrier assembly includes a thermoplastic polymer skin layer having opposite first and second major surfaces, and a barrier stack coated on the first major surface of the thermoplast...

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Bibliographische Detailangaben
Hauptverfasser: JONES, SCOTT JOSEPH, YU, TA-HUA, NEAVIN, TERENCE DENNIS, HAGEN, KEVIN DONALD, LYONS, CHRISTOPHER STEWART, MEVISSEN, ANDREW MICHAEL, LINDQUIST, TIMOTHY JOHN, MAKI, STEPHEN PAUL, JOHNSON, STEPHEN ALLAN, SPAGNOLA, JOSEPH CHARLES, ROEHRIG, MARK AUGUST, LOONEY, KENNETH LEE, MCCORMICK, FRED BOYLE, ROWE, DAVID JOHN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Barrier assemblies including ultrathin barrier laminates and methods of making the barrier assemblies are provided. A barrier assembly includes a thermoplastic polymer skin layer having opposite first and second major surfaces, and a barrier stack coated on the first major surface of the thermoplastic polymer skin layer to form an integral protective layer having a thickness no greater than about 0.5 mil (about 12.7 microns). The removable carrier film has a major surface releasably attached to the second major surface of the thermoplastic polymer skin layer. In some cases, the removal of the carrier film results in ultrathin barrier laminates.