Interconnect devices

Interconnect devices are described. In some examples, an interconnect device can be aligned in a first plane and can include a printed circuit board having a tongue portion and a pin portion. The pin portion can include a plurality of pins extending away from the printed circuit board. The interconn...

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Hauptverfasser: SILVANTO, MIKAEL M, TZIVISKOS, GEORGE, LIGTENBERG, CHRISTIAAN A, COOPER, EDWARD, LEGGETT, WILLIAM F, AMINI, MAHMOUD R, NARAJOWSKI, DAVID H, TALALAYEV, ANTON, STRINGER, CHRISTOPHER J
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:Interconnect devices are described. In some examples, an interconnect device can be aligned in a first plane and can include a printed circuit board having a tongue portion and a pin portion. The pin portion can include a plurality of pins extending away from the printed circuit board. The interconnect device can be configured to electrically couple with a main logic board aligned in a second plane. In particular, the plurality of pins can be inserted into corresponding electrical contact locations within the main logic board to form a biplanar connection. The biplanar connection can be made in way that minimizes signal loss for high speed data transfers.