Die bonder, bonding method and manufacturing method of semiconductor device for improving efficiency of a plurality of pick-and-place heads

To the solve the problem that when there is only a single push-up unit is (i.e. pick-and-place at the same location), the efficiency of a plurality of pick-and-place heads cannot be improved. A die bonder comprises a wafer support platform, a single push-up unit, a wafer recognition camera, a plurality of pick-and-place heads, a plurality of middle platforms, a plurality of bonding platforms, and a plurality of bonding heads. The wafer recognition camera utilizes a ratio of one-shooting for a plurality of die pick-and-place to capture the images for dies on the wafer.