Photosensitive resin composition, dry film, and printed wiring board

To provide a photosensitive resin composition which has a high dielectric constant and is also excellent in resolution, and to provide a dry film and a printed wiring board using the photosensitive resin composition. A photosensitive resin composition contains a carboxyl group-containing resin, a ph...

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Bibliographische Detailangaben
Hauptverfasser:	YUMOTO, MASAO, FUNAKOSHI, CHIHIRO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	To provide a photosensitive resin composition which has a high dielectric constant and is also excellent in resolution, and to provide a dry film and a printed wiring board using the photosensitive resin composition. A photosensitive resin composition contains a carboxyl group-containing resin, a photopolymerization initiator, and at least two perovskite type compounds. One of the perovskite type compounds is barium titanate. The dry film has a resin layer obtained by applying the photosensitive resin composition onto a film and drying it. A cured product is obtained by curing the photosensitive resin composition or the resin layer of the dry film. The printed wiring board has a cured film obtained by curing the photosensitive resin composition or the dry film.