Techniques to prevent film cracking in thermally cured dielectric film, and associated configurations

Embodiments of the present disclosure describe techniques to prevent film cracking in thermally cured dielectric film, and associated configurations. A dielectric film may be formed on a patterned metal layer and a substrate on which the patterned metal layer is disposed. A photo-patterned dielectri...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GANESAN, KRISHNA PRAKASH, LYTLE, WAYNE M, SATTIRAJU, SESHU V, KHIRE, VAIBHAV S
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!