Vacuum arc film-forming apparatus and film-forming method

A vacuum arc film-forming apparatus for forming a ta-C film on a substrate using arc discharge comprises: a holding unit for holding a target part; an anode part into which electrons discharged from said target part flow; and an electric power source for supplying electric current for generating pla...

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Bibliographische Detailangaben
Hauptverfasser:	SHIBAMOTO, MASAHIRO, WATANABE, YUTO, YAKUSHIJI, HIROSHI, MIURA, YUZURU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A vacuum arc film-forming apparatus for forming a ta-C film on a substrate using arc discharge comprises: a holding unit for holding a target part; an anode part into which electrons discharged from said target part flow; and an electric power source for supplying electric current for generating plasma between the target part and the anode part by arc discharge. The current that the electric power source supplies during said arc discharge is one in which a pulsed electric current with a pulse frequency of not more than 140 Hz is superimposed on a direct current.