Etching solution for resin molded body and use thereof

Provided is a technique with which decomposition of permanganic acid can be suppressed at low cost while maintaining the etching performance of the permanganic acid, the technique being achieved by an acidic etching solution including permanganate ion for resin molded bodies, the solution characteri...

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Bibliographische Detailangaben
Hauptverfasser:	KURAMOCHI, YASUYUKI, HORI, MASAO, IZUMITANI, MIYOKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL DYES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Provided is a technique with which decomposition of permanganic acid can be suppressed at low cost while maintaining the etching performance of the permanganic acid, the technique being achieved by an acidic etching solution including permanganate ion for resin molded bodies, the solution characterized by further including a pH buffer, and an etching method of the resin molded bodies and a method of plating on the resin molded bodies, which use the etching solution.