Fingerprint detection device and manufacturing method thereof which comprises an insulation encapsulation body, an image detection chip, a light emission element, and a conductive assembly
A fingerprint detection device comprises an insulation encapsulation body, an image detection chip, a light-emitting element, and a conductive assembly. The insulation encapsulation body has a front surface and a back surface. The front surface of the insulation encapsulation body is recessed, in a...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A fingerprint detection device comprises an insulation encapsulation body, an image detection chip, a light-emitting element, and a conductive assembly. The insulation encapsulation body has a front surface and a back surface. The front surface of the insulation encapsulation body is recessed, in a direction toward the back surface, to form a first trough and a second trough. The image detection chip is arranged in the first trough and has a chip surface that is exposed on the front surface through the first trough. The chip surface comprises a detection section and a conductive connection section. The light-emitting element is arranged in the second trough and has an outer surface that is exposed on the front surface through the second trough and an electrode unit arranged on the outer surface. The conductive assembly is formed inside the insulation encapsulation body, and two opposite ends of the conductive assembly are respectively exposed on the front surface and the back surface. The conductive assembly |
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