Direct circuit forming system for a substrate consisting of coupling bath, patterning apparatus, and metal deposition apparatus

A direct circuit forming system for a substrate, sequentially comprising: a coupling bath provided with a silane coupling agent for forming a silane layer bonded by silane molecules on the substrate when the substrate is immersed in the coupling bath; a patterning apparatus for selectively patterning the silane layer so that a circuit pattern is formed, and the surface of the circuit pattern is reacted to form a silanol layer; and a metal deposition apparatus for bonding the silanol layer with a precursor to form a precursor layer, and depositing the metal on the precursor layer so that the surface of the silane layer directly forms a circuit layer. A direct formation of a circuit can be achieved on the substrate.