Thin film for forming a protective film containing epoxy-based thermosetting component which includes fused cyclic aromatic compound having an epoxy group

The present invention provides a thin film for forming a protective film, which can produce a high strength protective film, contribute to enhanced productivity of wafers with a protective film, and obtain highly reliable wafers with a protective film. The thin film for forming a protective film of...

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Bibliographische Detailangaben
Hauptverfasser:	SAEKI, NAOYA, INAO, YOUICHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention provides a thin film for forming a protective film, which can produce a high strength protective film, contribute to enhanced productivity of wafers with a protective film, and obtain highly reliable wafers with a protective film. The thin film for forming a protective film of the present invention is used to form a protective film to protect semiconductor wafers. The thin film for forming a protective film contains an epoxy-based thermosetting component. The epoxy-based thermosetting component includes fused cyclic aromatic compound having an epoxy group.