Process for manufacturing a flexible circuit, flexible circuit obtained by this process and smartcard including such a flexible circuit

The invention relates to a process for manufacturing a flexible circuit. It comprises providing a sheet (11) of electrical conductor and a dielectric layer (50). It also comprises bringing the dielectric layer (50) into direct contact with the sheet (11) of electrical conductor and laminating them....

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Hauptverfasser: ARZINE, NAJATE, DIEU-GOMONT, SEVERINE, LAURENS DE LOPEZ, CLAIRE
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Sprache:chi ; eng
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creator ARZINE, NAJATE
DIEU-GOMONT, SEVERINE
LAURENS DE LOPEZ, CLAIRE
description The invention relates to a process for manufacturing a flexible circuit. It comprises providing a sheet (11) of electrical conductor and a dielectric layer (50). It also comprises bringing the dielectric layer (50) into direct contact with the sheet (11) of electrical conductor and laminating them. The dielectric layer (50) consists of a prepreg. Thus, the sheet (11) of electrical conductor may be laminated and adhesively bonded on the dielectric layer without recourse to an additional adhesive layer. The invention also relates to a flexible circuit for a smartcard, said circuit being manufactured with this process, and to a smartcard module including such a flexible circuit.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW201703605A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW201703605A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW201703605A3</originalsourceid><addsrcrecordid>eNqNzLEKwjAQxvEuDqK-w7krVEWdRRRHh4JjuV4u9iBNSi4BfQJfW4RuOjh98OfjNy5e1xiIVcGGCB36bJFSjuLvgGAdP6RxDCSRsqTFV4HQJBTPBponpFYU-sFDb0A7jIkwGhBPLpuPqpnaH_S0GFl0yrNhJ8X8fKqOlyX3oWbtkdhzqqvbulzty82u3B42_3zetoVMUA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Process for manufacturing a flexible circuit, flexible circuit obtained by this process and smartcard including such a flexible circuit</title><source>esp@cenet</source><creator>ARZINE, NAJATE ; DIEU-GOMONT, SEVERINE ; LAURENS DE LOPEZ, CLAIRE</creator><creatorcontrib>ARZINE, NAJATE ; DIEU-GOMONT, SEVERINE ; LAURENS DE LOPEZ, CLAIRE</creatorcontrib><description>The invention relates to a process for manufacturing a flexible circuit. It comprises providing a sheet (11) of electrical conductor and a dielectric layer (50). It also comprises bringing the dielectric layer (50) into direct contact with the sheet (11) of electrical conductor and laminating them. The dielectric layer (50) consists of a prepreg. Thus, the sheet (11) of electrical conductor may be laminated and adhesively bonded on the dielectric layer without recourse to an additional adhesive layer. The invention also relates to a flexible circuit for a smartcard, said circuit being manufactured with this process, and to a smartcard module including such a flexible circuit.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMPUTING ; COUNTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HANDLING RECORD CARRIERS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PHYSICS ; PRESENTATION OF DATA ; PRINTED CIRCUITS ; RECOGNITION OF DATA ; RECORD CARRIERS ; SEMICONDUCTOR DEVICES</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20170116&amp;DB=EPODOC&amp;CC=TW&amp;NR=201703605A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25555,76308</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20170116&amp;DB=EPODOC&amp;CC=TW&amp;NR=201703605A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ARZINE, NAJATE</creatorcontrib><creatorcontrib>DIEU-GOMONT, SEVERINE</creatorcontrib><creatorcontrib>LAURENS DE LOPEZ, CLAIRE</creatorcontrib><title>Process for manufacturing a flexible circuit, flexible circuit obtained by this process and smartcard including such a flexible circuit</title><description>The invention relates to a process for manufacturing a flexible circuit. It comprises providing a sheet (11) of electrical conductor and a dielectric layer (50). It also comprises bringing the dielectric layer (50) into direct contact with the sheet (11) of electrical conductor and laminating them. The dielectric layer (50) consists of a prepreg. Thus, the sheet (11) of electrical conductor may be laminated and adhesively bonded on the dielectric layer without recourse to an additional adhesive layer. The invention also relates to a flexible circuit for a smartcard, said circuit being manufactured with this process, and to a smartcard module including such a flexible circuit.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HANDLING RECORD CARRIERS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PHYSICS</subject><subject>PRESENTATION OF DATA</subject><subject>PRINTED CIRCUITS</subject><subject>RECOGNITION OF DATA</subject><subject>RECORD CARRIERS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2017</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNzLEKwjAQxvEuDqK-w7krVEWdRRRHh4JjuV4u9iBNSi4BfQJfW4RuOjh98OfjNy5e1xiIVcGGCB36bJFSjuLvgGAdP6RxDCSRsqTFV4HQJBTPBponpFYU-sFDb0A7jIkwGhBPLpuPqpnaH_S0GFl0yrNhJ8X8fKqOlyX3oWbtkdhzqqvbulzty82u3B42_3zetoVMUA</recordid><startdate>20170116</startdate><enddate>20170116</enddate><creator>ARZINE, NAJATE</creator><creator>DIEU-GOMONT, SEVERINE</creator><creator>LAURENS DE LOPEZ, CLAIRE</creator><scope>EVB</scope></search><sort><creationdate>20170116</creationdate><title>Process for manufacturing a flexible circuit, flexible circuit obtained by this process and smartcard including such a flexible circuit</title><author>ARZINE, NAJATE ; DIEU-GOMONT, SEVERINE ; LAURENS DE LOPEZ, CLAIRE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW201703605A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2017</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HANDLING RECORD CARRIERS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PHYSICS</topic><topic>PRESENTATION OF DATA</topic><topic>PRINTED CIRCUITS</topic><topic>RECOGNITION OF DATA</topic><topic>RECORD CARRIERS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>ARZINE, NAJATE</creatorcontrib><creatorcontrib>DIEU-GOMONT, SEVERINE</creatorcontrib><creatorcontrib>LAURENS DE LOPEZ, CLAIRE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ARZINE, NAJATE</au><au>DIEU-GOMONT, SEVERINE</au><au>LAURENS DE LOPEZ, CLAIRE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Process for manufacturing a flexible circuit, flexible circuit obtained by this process and smartcard including such a flexible circuit</title><date>2017-01-16</date><risdate>2017</risdate><abstract>The invention relates to a process for manufacturing a flexible circuit. It comprises providing a sheet (11) of electrical conductor and a dielectric layer (50). It also comprises bringing the dielectric layer (50) into direct contact with the sheet (11) of electrical conductor and laminating them. The dielectric layer (50) consists of a prepreg. Thus, the sheet (11) of electrical conductor may be laminated and adhesively bonded on the dielectric layer without recourse to an additional adhesive layer. The invention also relates to a flexible circuit for a smartcard, said circuit being manufactured with this process, and to a smartcard module including such a flexible circuit.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HANDLING RECORD CARRIERS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRESENTATION OF DATA
PRINTED CIRCUITS
RECOGNITION OF DATA
RECORD CARRIERS
SEMICONDUCTOR DEVICES
title Process for manufacturing a flexible circuit, flexible circuit obtained by this process and smartcard including such a flexible circuit
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-15T06%3A22%3A58IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ARZINE,%20NAJATE&rft.date=2017-01-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW201703605A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true