Process for manufacturing a flexible circuit, flexible circuit obtained by this process and smartcard including such a flexible circuit
The invention relates to a process for manufacturing a flexible circuit. It comprises providing a sheet (11) of electrical conductor and a dielectric layer (50). It also comprises bringing the dielectric layer (50) into direct contact with the sheet (11) of electrical conductor and laminating them....
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a process for manufacturing a flexible circuit. It comprises providing a sheet (11) of electrical conductor and a dielectric layer (50). It also comprises bringing the dielectric layer (50) into direct contact with the sheet (11) of electrical conductor and laminating them. The dielectric layer (50) consists of a prepreg. Thus, the sheet (11) of electrical conductor may be laminated and adhesively bonded on the dielectric layer without recourse to an additional adhesive layer. The invention also relates to a flexible circuit for a smartcard, said circuit being manufactured with this process, and to a smartcard module including such a flexible circuit. |
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