Resin composition capable of forming an insulating layer having excellent adhesion to a conductor layer even at low roughness

The present invention is to provide a resin composition capable of forming an insulating layer which has an excellent adhesiveness to a conductor layer and a high glass transition point even at low roughness, and it can form an excellent adhesion to the conductor layer. The present invention also pr...

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Bibliographische Detailangaben
Hauptverfasser:	EDO, YUKINORI, KAWAI, KENJI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention is to provide a resin composition capable of forming an insulating layer which has an excellent adhesiveness to a conductor layer and a high glass transition point even at low roughness, and it can form an excellent adhesion to the conductor layer. The present invention also provides an adhesive film, a prepreg, a printed wiring board, and a semiconductor device using the resin composition. The solution of the present solution is a resin composition, which comprises (A) epoxy resin, (B) maleimide-containing silyl protected phenol, and (C) an active ester compound.