Resin composition, resin sheet, prepreg, insulator, hardened resin sheet and heat dissipation member

A resin composition contains a thermosetting resin, a thermally conductive filler and mica, in which, when the thermally conductive filler is divided into a filler group (A) whose particle diameter is from 10 [mu]m to 100 [mu]m, a filler group (B) whose particle diameter is from 1.0 [mu]m to less th...

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Bibliographische Detailangaben
Hauptverfasser:	TANASE, TOMOKAZU, KOJIMA, HIROAKI, TAKEZAWA, YOSHITAKA, FUKUSHIMA, KEIJI, SANO, AKIHIRO, SONG, SHI-HUI, KATOH, TETSUJI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON CONDUCTORS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	A resin composition contains a thermosetting resin, a thermally conductive filler and mica, in which, when the thermally conductive filler is divided into a filler group (A) whose particle diameter is from 10 [mu]m to 100 [mu]m, a filler group (B) whose particle diameter is from 1.0 [mu]m to less than 10 [mu]m, and a filler group (C) whose particle diameter is from 0.1 [mu]m to less than 1.0 [mu]m, the volume-based content of the filler group (C) is larger than the volume-based content of the filler group (B). The resin composition is used in a resin sheet, a prepreg, an insulator, a hardened resin sheet and a heat dissipation member.