Memory cooling pad

Memory cooling pad

In one implementation, a system for a memory cooling pad includes a first thermal interface material coupled to a second thermal interface material by a liner material configured to position the first thermal interface material on a first side of a memory unit and to position the second thermal inte...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CADER, TAHIR, FRANZ, JOHN P, BARGERHUFF, RICHARD A, BOWDEN, THOMAS R, ZIMMERMAN SR., SAMMY L
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:In one implementation, a system for a memory cooling pad includes a first thermal interface material coupled to a second thermal interface material by a liner material configured to position the first thermal interface material on a first side of a memory unit and to position the second thermal interface material on a second side of the memory unit.