Substrate structure
Provided is a substrate structure, including a substrate body formed with a plurality of electrical contact pads; first and second conductive bumps formed on the electrical contact pads, wherein the width of the second conductive bump is smaller than that of the first conductive bump, and in basis o...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | Provided is a substrate structure, including a substrate body formed with a plurality of electrical contact pads; first and second conductive bumps formed on the electrical contact pads, wherein the width of the second conductive bump is smaller than that of the first conductive bump, and in basis of the substrate body, the second conductive bump has a greater height than that of the first conductive bump to thereby compensates the height difference after reflowing the first and second conductive bumps. |
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