Marking device and method, pattern generation device, and workpiece

This marking device (1) has: a first laser machining unit (3a, 3b) for marking a workpiece at a first dot diameter; a second laser machining unit (5a, 5b) as a second marking unit for marking the workpiece at a second dot diameter that is less than the first dot diameter; and a device (PC7) for reco...

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Bibliographische Detailangaben
Hauptverfasser:	OKABE, HITOSHI, TAO, MASANORI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	This marking device (1) has: a first laser machining unit (3a, 3b) for marking a workpiece at a first dot diameter; a second laser machining unit (5a, 5b) as a second marking unit for marking the workpiece at a second dot diameter that is less than the first dot diameter; and a device (PC7) for recording a drawing pattern split into a first drawing pattern drawn by the first laser machining unit (3a, 3b) and a second drawing pattern drawn by the second laser machining unit (5a, 5b). The first drawing pattern and the second drawing pattern, by being drawn in a mutually superimposed fashion, form a prescribed drawing pattern on the workpiece, and the second drawing pattern includes a contour pattern that fills in the edge portion of the first drawing pattern, whereby improved machining accuracy and shorter working time are achieved at the same time.