Method of setting laser drilling processing conditions and laser processing machine

The present invention aims to provide a method of setting laser drilling processing conditions for reducing the parametric changes that require experience and proficiency, enabling confirmation of a hole shape without removing a substrate and without manually inputting parameters of optimum conditio...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SAEKI, YUKI, MINOSHIMA, YU, KITA, YASUHIKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PHYSICS SOLDERING OR UNSOLDERING TESTING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The present invention aims to provide a method of setting laser drilling processing conditions for reducing the parametric changes that require experience and proficiency, enabling confirmation of a hole shape without removing a substrate and without manually inputting parameters of optimum condition, and a laser processing machine. The method comprises the following steps: providing at least five test regions, namely the center and four corners of the processing region; processing a hole group consisting of at least 16 holes having different processing conditions in each test region; comparing the hole size, the hole shape, and the hole location of holes formed under the same processing conditions in each test region with the same parameters of holes formed under other processing conditions; and selecting the optimum drilling processing condition after the comparison.