Sapphire substrate polishing agent composition

Provided is a sapphire substrate polishing agent composition with which a high-precision polished surface free from surface defects such as scratches can be obtained at a high polishing speed. The sapphire substrate polishing agent composition contains, as components, inorganic polishing particles,...

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Bibliographische Detailangaben
Hauptverfasser:	YAMAGUCHI, YOSHINOBU, NAITO, KENJI, HORIMOTO, SANAKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided is a sapphire substrate polishing agent composition with which a high-precision polished surface free from surface defects such as scratches can be obtained at a high polishing speed. The sapphire substrate polishing agent composition contains, as components, inorganic polishing particles, a polishing accelerator, and water. The inorganic polishing particles are alumina particles, the polishing accelerator is an organic carboxylic acid-based chelating compound, and the pH is 9.0-13.0.