Coating device

A coating liquid is applied uniformly on a substrate in-plane surface. At a time T1 when the coating process begins, when a first edge section of a discharge opening of a coating nozzle is positioned at one wafer circumferential edge, the wafer and the coating nozzle are moved relative to each other...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	WAKAMOTO, YUKIHIRO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY NOZZLES PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	A coating liquid is applied uniformly on a substrate in-plane surface. At a time T1 when the coating process begins, when a first edge section of a discharge opening of a coating nozzle is positioned at one wafer circumferential edge, the wafer and the coating nozzle are moved relative to each other by a moving mechanism while the coating liquid is exposed from the discharge opening. From a time T2 to a time T3 during the coating process, the wafer and the coating nozzle are moved relative to each other by a moving mechanism while the coating liquid discharged from the discharge opening is applied to the wafer, thereby coating the wafer with the coating liquid. At the time T3 when the coating has finished, when a second edge section of the discharge opening is positioned at the opposite wafer circumferential edge, the wafer and the coating nozzle are moved relative to each other by a moving mechanism while the coating liquid is exposed from the discharge opening.